Sci-Tech

The world's first full frequency high-speed communication chip has been launched

2025-08-29   

Using advanced thin-film lithium niobate photonics materials, Chinese scholars have developed the world's first adaptive, full frequency, high-speed wireless communication chip based on optoelectronic fusion integration technology. This achievement was published on the 27th in the top international academic journal Nature. Traditional electronic hardware can only operate in a single frequency band, and devices in different frequency bands rely on different design rules, structural schemes, and material systems, making it difficult to achieve cross frequency operation. This integrated chip, jointly developed by Professor Wang Xingjun and others from Peking University, has the ability to convert broadband wireless and optical signals, coordinate low-noise carrier local oscillator signals, and modulate digital baseband signals, successfully bridging the "band gap" of devices in different frequency bands. Based on this chip, the team further proposed an integrated optoelectronic oscillator (OEO) architecture for high-performance optical micro ring resonators. Compared to traditional electronic solutions based on frequency multipliers, this on-chip OEO system utilizes high-precision optical micro rings to "lock" frequencies, achieving for the first time the rapid, accurate, and low-noise generation of communication signals at any frequency point in the ultra wide frequency range of 0.5 GHz to 115 GHz. The new system can schedule high frequency bands with abundant data resources and extremely high speeds, but difficult to transmit over long distances, as well as low frequency bands with strong penetration and wide coverage but limited capacity. It overcomes the problem of previous systems being unable to balance bandwidth, noise performance, and reconfigurability, and is a milestone breakthrough. Experimental verification shows that the transmission rate of the new system exceeds 120 gigabits per second, meeting the peak rate requirements of 6G communication, and the end-to-end wireless communication link has consistent performance across the entire frequency band. This has cleared the obstacles for the efficient development of 6G communication in the terahertz and even higher frequency spectrum resources. Wang Xingjun stated that the chip will lay the hardware foundation for "AI (Artificial Intelligence) native networks". It can dynamically adjust communication parameters through built-in algorithms to cope with complex electromagnetic environments, and can also enable future base stations and vehicle mounted devices to accurately perceive the surrounding environment when transmitting data, driving the upgrade of key components such as broadband antennas and optoelectronic integration modules, bringing about a complete chain transformation from materials and devices to the whole machine and network. (New Society)

Edit:Momo Responsible editor:Chen zhaozhao

Source:Science and Technology Daily

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